{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10545581","patent":{"patent_number":"US-10545581","title":"Semiconductor package device","assignee":null,"inventors":[],"filing_date":"2017-10-05T00:00:00.000Z","publication_date":"2020-01-28T00:00:00.000Z","cpc_codes":["G06F","G06F"],"num_claims":24,"abstract":"An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening penetrating the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package device","description":"An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10545581","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10545581","citation_suggestion":"Patentable. \"Semiconductor package device\" (US-10545581). https://patentable.app/patents/US-10545581","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10545581","json":"https://patentable.app/api/llm-context/US-10545581","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T07:41:40.760Z"}