{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10546794","patent":{"patent_number":"US-10546794","title":"Method of reducing warpage of semiconductor package substrate and device for reducing warpage","assignee":null,"inventors":[],"filing_date":"2017-11-17T00:00:00.000Z","publication_date":"2020-01-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"Embodiments disclosed are directed to a method of reducing warpage of a semiconductor package substrate, and a warpage reducing device. The method includes preparing the semiconductor package substrate, heating the prepared semiconductor package substrate, forming at least one bend in the heated semiconductor package substrate, and cooling the semiconductor package substrate having the at least one bend is formed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of reducing warpage of semiconductor package substrate and device for reducing warpage","description":"Embodiments disclosed are directed to a method of reducing warpage of a semiconductor package substrate, and a warpage reducing device. The method includes preparing the semiconductor package substrat","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10546794","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10546794","citation_suggestion":"Patentable. \"Method of reducing warpage of semiconductor package substrate and device for reducing warpage\" (US-10546794). https://patentable.app/patents/US-10546794","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10546794","json":"https://patentable.app/api/llm-context/US-10546794","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:36:30.570Z"}