{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10546797","patent":{"patent_number":"US-10546797","title":"Heat transfer structure and manufacturing method therefore","assignee":null,"inventors":[],"filing_date":"2016-06-23T00:00:00.000Z","publication_date":"2020-01-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":22,"abstract":"Provided are (i) a heat transport structure which is excellent in heat transfer efficiency and (ii) a method of producing such a heat transport structure. The heat transport structure in accordance with an embodiment of the present invention includes: a first thermally conductive material in which through holes are formed; and second thermally conductive materials which are fitted in the respective through holes in a perpendicular direction which is a direction perpendicular to a surface direction, a thermal conductivity which the first thermally conductive material exhibits in the surface direction being higher than a thermal conductivity which the first thermally conductive material exhibits in the perpendicular direction, each of the second thermally conductive materials being held by an inner surface of a corresponding one of the through holes and having fitting strength of not less than 0.5 N/mm per unit circumference of the corresponding one of the through holes."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat transfer structure and manufacturing method therefore","description":"Provided are (i) a heat transport structure which is excellent in heat transfer efficiency and (ii) a method of producing such a heat transport structure. The heat transport structure in accordance wi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10546797","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10546797","citation_suggestion":"Patentable. \"Heat transfer structure and manufacturing method therefore\" (US-10546797). https://patentable.app/patents/US-10546797","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10546797","json":"https://patentable.app/api/llm-context/US-10546797","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T19:35:47.626Z"}