{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10546815","patent":{"patent_number":"US-10546815","title":"Low resistance interconnect structure with partial seed enhancement liner","assignee":null,"inventors":[],"filing_date":"2018-05-31T00:00:00.000Z","publication_date":"2020-01-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A method which exploits the benefits of a seed enhancement layer (in terms of void-free copper fill), while preventing copper volume loss during planarization, is provided. The method includes forming a partial seed enhancement liner in a lower portion of an opening that contains a recessed copper portion. Additional copper is formed in the upper portion of the opening providing a copper structure in which no copper volume loss at the uppermost interface of the copper structure is observed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Low resistance interconnect structure with partial seed enhancement liner","description":"A method which exploits the benefits of a seed enhancement layer (in terms of void-free copper fill), while preventing copper volume loss during planarization, is provided. The method includes forming","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10546815","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10546815","citation_suggestion":"Patentable. \"Low resistance interconnect structure with partial seed enhancement liner\" (US-10546815). https://patentable.app/patents/US-10546815","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10546815","json":"https://patentable.app/api/llm-context/US-10546815","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:46:07.288Z"}