{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10546827","patent":{"patent_number":"US-10546827","title":"Flip chip","assignee":null,"inventors":[],"filing_date":"2017-06-08T00:00:00.000Z","publication_date":"2020-01-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"A flip chip includes a substrate, an electrode pad layer stacked over the substrate, a passivation layer stacked at both ends of the electrode pad layer, an under bump metallurgy (UBM) layer stacked over the electrode pad layer and the passivation layer, and a bump formed over the UBM layer. The width of an opening on which the passivation layer is not formed over the electrode pad layer is greater than the width of the bump. The flip chip can prevent a crack from being generated in the pad upon ultrasonic bonding."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Flip chip","description":"A flip chip includes a substrate, an electrode pad layer stacked over the substrate, a passivation layer stacked at both ends of the electrode pad layer, an under bump metallurgy (UBM) layer stacked o","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10546827","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10546827","citation_suggestion":"Patentable. \"Flip chip\" (US-10546827). https://patentable.app/patents/US-10546827","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10546827","json":"https://patentable.app/api/llm-context/US-10546827","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:47:17.023Z"}