{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-10546829","patent":{"patent_number":"US-10546829","title":"Method of fabricating semiconductor package","assignee":null,"inventors":[],"filing_date":"2018-01-10T00:00:00.000Z","publication_date":"2020-01-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of fabricating a semiconductor package including forming a preliminary first insulating layer including a first opening, curing the preliminary first insulating layer to form a first insulating layer, forming a preliminary second insulating layer on the first insulating layer at least partially filling the first opening. The method includes forming a second opening in the preliminary second insulating layer at least partially overlapping the first opening. A sidewall of the first opening is at least partially exposed during forming the second opening. The preliminary second insulating layer is cured to form a second insulating layer. A barrier metal layer is formed along the sidewall of the first opening and along a sidewall of the second opening. A redistribution conductive pattern is formed on the barrier metal layer. A planarization process is performed to at least partially expose the second insulating layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of fabricating semiconductor package","description":"A method of fabricating a semiconductor package including forming a preliminary first insulating layer including a first opening, curing the preliminary first insulating layer to form a first insulati","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-10546829","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-10546829","citation_suggestion":"Patentable. \"Method of fabricating semiconductor package\" (US-10546829). https://patentable.app/patents/US-10546829","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-10546829","json":"https://patentable.app/api/llm-context/US-10546829","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T08:44:15.960Z"}