{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11232977","patent":{"patent_number":"US-11232977","title":"Stepped top via for via resistance reduction","assignee":null,"inventors":[],"filing_date":"2020-02-11T00:00:00.000Z","publication_date":"2022-01-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"Embodiments of the present invention are directed to fabrication methods and resulting interconnect structures having stepped top vias that reduce via resistance. In a non-limiting embodiment of the invention, a surface of a conductive line is recessed below a first dielectric layer. A second dielectric layer is formed on the recessed surface and an etch stop layer is formed over the structure. A first cavity is formed that exposes the recessed surface of the conductive line and sidewalls of the second dielectric layer. The first cavity includes a first width between sidewalls of the etch stop layer. The second dielectric layer is removed to define a second cavity having a second width greater than the first width. A stepped top via is formed on the recessed surface of the conductive line. The top via includes a top portion in the first cavity and a bottom portion in the second cavity."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stepped top via for via resistance reduction","description":"Embodiments of the present invention are directed to fabrication methods and resulting interconnect structures having stepped top vias that reduce via resistance. In a non-limiting embodiment of the i","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11232977","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11232977","citation_suggestion":"Patentable. \"Stepped top via for via resistance reduction\" (US-11232977). https://patentable.app/patents/US-11232977","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11232977","json":"https://patentable.app/api/llm-context/US-11232977","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:16:02.011Z"}