{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11232979","patent":{"patent_number":"US-11232979","title":"Method of forming trenches","assignee":null,"inventors":[],"filing_date":"2018-07-27T00:00:00.000Z","publication_date":"2022-01-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Methods are disclosed herein that improve contours of trenches formed when fabricating vias and conductive lines of a multi-layer interconnect (MLI) structure. An exemplary device that can result from such methods includes a via of an MLI structure and a conductive line of the MLI structure disposed over the via. A first dielectric liner layer is disposed along sidewalls of the via and sidewalls of the conductive line. A thickness of the first dielectric liner layer is substantially the same along the sidewalls of the via. A thickness of the first dielectric liner layer increases along the sidewalls of the conductive line, such that the first dielectric liner layer has a tiger-tooth shape at each bottom corner of the conductive line. A second dielectric liner layer is disposed along the first dielectric liner layer that is disposed along the sidewalls of the via."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of forming trenches","description":"Methods are disclosed herein that improve contours of trenches formed when fabricating vias and conductive lines of a multi-layer interconnect (MLI) structure. An exemplary device that can result from","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11232979","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11232979","citation_suggestion":"Patentable. \"Method of forming trenches\" (US-11232979). https://patentable.app/patents/US-11232979","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11232979","json":"https://patentable.app/api/llm-context/US-11232979","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T13:25:52.087Z"}