{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11233001","patent":{"patent_number":"US-11233001","title":"Adhesive layer bonding a plurality of substrates having a fillet raised portion","assignee":null,"inventors":[],"filing_date":"2019-12-12T00:00:00.000Z","publication_date":"2022-01-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"An interconnect board includes: a first substrate; a second substrate having an outer shape smaller than an outer shape of the first substrate and mounted on the first substrate; and an adhesive layer bonding the first substrate and the second substrate together and having a fillet contacting a side surface of the second substrate. The fillet has a raised portion raised from a level of a top surface of the second substrate to a level higher than the top surface of the second substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Adhesive layer bonding a plurality of substrates having a fillet raised portion","description":"An interconnect board includes: a first substrate; a second substrate having an outer shape smaller than an outer shape of the first substrate and mounted on the first substrate; and an adhesive layer","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11233001","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11233001","citation_suggestion":"Patentable. \"Adhesive layer bonding a plurality of substrates having a fillet raised portion\" (US-11233001). https://patentable.app/patents/US-11233001","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11233001","json":"https://patentable.app/api/llm-context/US-11233001","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T04:21:00.656Z"}