{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11233005","patent":{"patent_number":"US-11233005","title":"Method for manufacturing an anchor-shaped backside via","assignee":null,"inventors":[],"filing_date":"2020-07-10T00:00:00.000Z","publication_date":"2022-01-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method includes providing a fin, an isolation structure, and first and second source/drain (S/D) features over the fin; forming an etch mask covering a first portion and exposing a second portion of the fin; removing the second portion of the fin, resulting in a first trench; filling the first trench with a first dielectric feature; removing the etch mask; and applying etching process(es) to remove the first portion of the fin and to partially recess the first S/D feature. The etching process(es) includes an isotropic etching tuned selective to materials of the first S/D feature and not materials of the isolation structure and the first dielectric feature, resulting in a second trench under the first S/D feature and having a gap between a bottom surface of the first S/D feature and a top surface of the isolation structure. The method further includes forming a via in the second trench."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for manufacturing an anchor-shaped backside via","description":"A method includes providing a fin, an isolation structure, and first and second source/drain (S/D) features over the fin; forming an etch mask covering a first portion and exposing a second portion of","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11233005","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11233005","citation_suggestion":"Patentable. \"Method for manufacturing an anchor-shaped backside via\" (US-11233005). https://patentable.app/patents/US-11233005","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11233005","json":"https://patentable.app/api/llm-context/US-11233005","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T10:11:02.687Z"}