{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11233020","patent":{"patent_number":"US-11233020","title":"Semiconductor package device and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2019-05-15T00:00:00.000Z","publication_date":"2022-01-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":31,"abstract":"A semiconductor package device includes: (1) a die having an active surface, a back surface opposite to the active surface and a lateral surface extending between the active surface and the back surface; (2) a first conductive pillar disposed on the active surface of the die and electrically connected to the die, the first conductive pillar having a top surface facing away from the die and a lateral surface substantially perpendicular to the top surface of the first conductive pillar; (3) a dielectric layer disposed on the active surface of the die and fully covering the lateral surface of the first conductive pillar; and (4) a package body encapsulating the back surface and the lateral surface of the die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package device and method of manufacturing the same","description":"A semiconductor package device includes: (1) a die having an active surface, a back surface opposite to the active surface and a lateral surface extending between the active surface and the back surfa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11233020","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11233020","citation_suggestion":"Patentable. \"Semiconductor package device and method of manufacturing the same\" (US-11233020). https://patentable.app/patents/US-11233020","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11233020","json":"https://patentable.app/api/llm-context/US-11233020","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:25:10.247Z"}