{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11233033","patent":{"patent_number":"US-11233033","title":"Semiconductor packages including chips stacked on a base module","assignee":null,"inventors":[],"filing_date":"2020-06-11T00:00:00.000Z","publication_date":"2022-01-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package includes a package substrate, a base module disposed on the package substrate and configured to include an intermediate chip, bonding wires connecting the intermediate chip to the package substrate, a lower-left chip disposed between the base module and the package substrate, and an upper-left chip disposed on the base module. The base module further includes an encapsulant encapsulating the intermediate chip, through vias electrically connected to the upper-left chip, and redistributed lines (RDLs) connecting the intermediate chip to the through vias and extending to provide connection parts which are spaced apart from the through vias and are connected to the lower-left chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packages including chips stacked on a base module","description":"A semiconductor package includes a package substrate, a base module disposed on the package substrate and configured to include an intermediate chip, bonding wires connecting the intermediate chip to ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11233033","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11233033","citation_suggestion":"Patentable. \"Semiconductor packages including chips stacked on a base module\" (US-11233033). https://patentable.app/patents/US-11233033","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11233033","json":"https://patentable.app/api/llm-context/US-11233033","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:59:19.178Z"}