{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11233035","patent":{"patent_number":"US-11233035","title":"Package structure and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2020-05-28T00:00:00.000Z","publication_date":"2022-01-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package structure includes a first die, a die stack structure, a support structure and an insulation structure. The die stack structure is bonded to the first die. The support structure is disposed on the die stack structure. A width of the support structure is larger than a width of the die stack structure and less than a width of the first die. The insulation structure at least laterally wraps around the die stack structure and the support structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure and method of manufacturing the same","description":"A package structure includes a first die, a die stack structure, a support structure and an insulation structure. The die stack structure is bonded to the first die. The support structure is disposed ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11233035","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11233035","citation_suggestion":"Patentable. \"Package structure and method of manufacturing the same\" (US-11233035). https://patentable.app/patents/US-11233035","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11233035","json":"https://patentable.app/api/llm-context/US-11233035","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T07:58:48.338Z"}