{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11234329","patent":{"patent_number":"US-11234329","title":"Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit board","assignee":null,"inventors":[],"filing_date":"2018-12-04T00:00:00.000Z","publication_date":"2022-01-25T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9≤X2/X1≤1.0 (I), where X1 is a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and X2 is a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit board","description":"A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the p","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11234329","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11234329","citation_suggestion":"Patentable. \"Prepreg, substrate, metal-clad laminate, semiconductor package, and printed circuit board\" (US-11234329). https://patentable.app/patents/US-11234329","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11234329","json":"https://patentable.app/api/llm-context/US-11234329","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:06:40.683Z"}