{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11239127","patent":{"patent_number":"US-11239127","title":"Topside-cooled semiconductor package with molded standoff","assignee":null,"inventors":[],"filing_date":"2020-06-19T00:00:00.000Z","publication_date":"2022-02-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A molded semiconductor package arrangement may comprise a die pad configured to support a semiconductor; a set of leads; and a mold structure that is formed to enclose the semiconductor and the die pad within the mold structure. The set of leads and the die pad may be formed from a same piece of conductive material. An electrical contact plane of the set of leads may be offset from a bottom surface of the die pad. The mold structure may include a molded standoff that is beneath the die pad. A bottom surface of the molded standoff may extend below the electrical contact plane of the set of leads by a threshold distance that corresponds to a thickness of the molded standoff."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Topside-cooled semiconductor package with molded standoff","description":"A molded semiconductor package arrangement may comprise a die pad configured to support a semiconductor; a set of leads; and a mold structure that is formed to enclose the semiconductor and the die pa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11239127","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11239127","citation_suggestion":"Patentable. \"Topside-cooled semiconductor package with molded standoff\" (US-11239127). https://patentable.app/patents/US-11239127","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11239127","json":"https://patentable.app/api/llm-context/US-11239127","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:39:34.633Z"}