{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11239144","patent":{"patent_number":"US-11239144","title":"Semiconductor device and method of producing semiconductor device","assignee":null,"inventors":[],"filing_date":"2019-12-06T00:00:00.000Z","publication_date":"2022-02-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A semiconductor device includes a mounting substrate; a first wiring electrode and a second wiring electrode disposed on a main surface of a mounting substrate; an interposing member disposed between the first wiring electrode and the second wiring electrode; a semiconductor element flip-chip connected with the first wiring electrode and the second wiring electrode via a first electrical connection member and a second electrical connection member so as to at least partially overlap the interposing member in a top surface view; and a resin disposed in contact with the semiconductor element and the mounting substrate. The wettability of the interposing member to the resin is higher than that of the mounting substrate to the resin. The resin is disposed in contact with the semiconductor element and the interposing member."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and method of producing semiconductor device","description":"A semiconductor device includes a mounting substrate; a first wiring electrode and a second wiring electrode disposed on a main surface of a mounting substrate; an interposing member disposed between ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11239144","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11239144","citation_suggestion":"Patentable. \"Semiconductor device and method of producing semiconductor device\" (US-11239144). https://patentable.app/patents/US-11239144","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11239144","json":"https://patentable.app/api/llm-context/US-11239144","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T07:33:47.514Z"}