{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11239156","patent":{"patent_number":"US-11239156","title":"Planar slab vias for integrated circuit interconnects","assignee":null,"inventors":[],"filing_date":"2020-03-19T00:00:00.000Z","publication_date":"2022-02-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"Integrated circuitry comprising devices electrically coupled through a plurality of interconnect levels in which lines of a first and second interconnect level are coupled through a planar slab via. An interconnect line may include a horizontal line segment within one of the first or second interconnect levels, and the slab via may be a vertical line segment between the first and second interconnect levels. A planar slab via may comprise one or more layers of conductive material, which have been deposited upon a planarized substrate material that lacks any features that the conductive material must fill. A planar slab via may be subtractively defined concurrently with a horizontal line of one or both of the first or second interconnect levels."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Planar slab vias for integrated circuit interconnects","description":"Integrated circuitry comprising devices electrically coupled through a plurality of interconnect levels in which lines of a first and second interconnect level are coupled through a planar slab via. A","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11239156","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11239156","citation_suggestion":"Patentable. \"Planar slab vias for integrated circuit interconnects\" (US-11239156). https://patentable.app/patents/US-11239156","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11239156","json":"https://patentable.app/api/llm-context/US-11239156","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:23:01.239Z"}