{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11239158","patent":{"patent_number":"US-11239158","title":"Wire bond inductor structures for flip chip dies","assignee":null,"inventors":[],"filing_date":"2020-10-08T00:00:00.000Z","publication_date":"2022-02-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated circuit (IC) package comprising a first die, including an active layer opposite a backside surface of the first die supporting a plurality of backside pads is provided. The IC package also incorporates a package substrate coupled to the active layer. The package pads on the package substrate correspond to the plurality of backside pads. A passive device comprising a plurality of wire bonds is coupled to the plurality of backside pads and the plurality of package pads. The passive device may also comprise a plurality of wire bonds coupled to the package pads by through silicon vias (TSVs). Multiple dies may be coupled with die-to-die wire bonds coupled to backside pads on each die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wire bond inductor structures for flip chip dies","description":"An integrated circuit (IC) package comprising a first die, including an active layer opposite a backside surface of the first die supporting a plurality of backside pads is provided. The IC package al","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11239158","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11239158","citation_suggestion":"Patentable. \"Wire bond inductor structures for flip chip dies\" (US-11239158). https://patentable.app/patents/US-11239158","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11239158","json":"https://patentable.app/api/llm-context/US-11239158","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T07:35:13.402Z"}