{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11239167","patent":{"patent_number":"US-11239167","title":"Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrate","assignee":null,"inventors":[],"filing_date":"2019-12-04T00:00:00.000Z","publication_date":"2022-02-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Copper (Cu)-to-Cu bonding techniques for high bandwidth interconnects on a bridge chip attached to chips which are further attached to a packaging substrate are provided. In one aspect, a method of forming an interconnect structure is provided. The method includes: bonding individual chips to at least one bridge chip via Cu-to-Cu bonding to form a multi-chip structure; and bonding the multi-chip structure to a packaging substrate via solder bonding, after the Cu-to-Cu bonding has been performed, to form the interconnect structure including the individual chips bonded to the at least one bridge chip and to the packaging substrate. A structure formed by the method is also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrate","description":"Copper (Cu)-to-Cu bonding techniques for high bandwidth interconnects on a bridge chip attached to chips which are further attached to a packaging substrate are provided. In one aspect, a method of fo","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11239167","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11239167","citation_suggestion":"Patentable. \"Cu—Cu bonding for interconnects on bridge chip attached to chips and packaging substrate\" (US-11239167). https://patentable.app/patents/US-11239167","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11239167","json":"https://patentable.app/api/llm-context/US-11239167","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:12:48.306Z"}