{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11239172","patent":{"patent_number":"US-11239172","title":"Flexible circuit board and chip package including same","assignee":null,"inventors":[],"filing_date":"2018-10-25T00:00:00.000Z","publication_date":"2022-02-01T00:00:00.000Z","cpc_codes":["H01L","H01L","G06F","G06F","G06F","H01L","H01L","H01L","H01L","H01L","G06F","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Flexible circuit board and chip package including same","description":"A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11239172","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11239172","citation_suggestion":"Patentable. \"Flexible circuit board and chip package including same\" (US-11239172). https://patentable.app/patents/US-11239172","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11239172","json":"https://patentable.app/api/llm-context/US-11239172","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:29:11.892Z"}