{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11239174","patent":{"patent_number":"US-11239174","title":"Semiconductor package structure and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2019-12-27T00:00:00.000Z","publication_date":"2022-02-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"A semiconductor package structure includes a first semiconductor die, a second semiconductor die, a third semiconductor die and an external contact. The second semiconductor die is disposed adjacent to the first semiconductor die. The third semiconductor die electrically connects the first semiconductor die and the second semiconductor die. The external contact is electrically connected to the third semiconductor die. An electrical path between the third semiconductor die and the external contact extends through a space between the first semiconductor die and the second semiconductor die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package structure and method for manufacturing the same","description":"A semiconductor package structure includes a first semiconductor die, a second semiconductor die, a third semiconductor die and an external contact. The second semiconductor die is disposed adjacent t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11239174","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11239174","citation_suggestion":"Patentable. \"Semiconductor package structure and method for manufacturing the same\" (US-11239174). https://patentable.app/patents/US-11239174","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11239174","json":"https://patentable.app/api/llm-context/US-11239174","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T12:47:56.625Z"}