{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11239179","patent":{"patent_number":"US-11239179","title":"Semiconductor package and fabrication method thereof","assignee":null,"inventors":[],"filing_date":"2020-07-13T00:00:00.000Z","publication_date":"2022-02-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":31,"abstract":"A semiconductor package includes a substrate having thereon a high-frequency chip and a circuit component susceptible to high-frequency signal interference; a ground pad on the and between the high-frequency chip and the circuit component; a metal-post reinforced glue wall on the ground pad; a molding compound surrounding the metal-post reinforced glue wall and surrounding the high-frequency chip and the circuit component; and a conductive layer disposed on the molding compound and in contact with the metal-post reinforced glue wall. The metal-post reinforced glue wall comprises first metal posts and glue attached to the first metal posts. An interface between a base of each of the first metal posts and the ground pad has a root mean square (RMS) roughness that is less than 1.0 micrometer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and fabrication method thereof","description":"A semiconductor package includes a substrate having thereon a high-frequency chip and a circuit component susceptible to high-frequency signal interference; a ground pad on the and between the high-fr","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11239179","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11239179","citation_suggestion":"Patentable. \"Semiconductor package and fabrication method thereof\" (US-11239179). https://patentable.app/patents/US-11239179","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11239179","json":"https://patentable.app/api/llm-context/US-11239179","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T10:03:37.382Z"}