{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11239183","patent":{"patent_number":"US-11239183","title":"Mitigating thermal-mechanical strain and warpage of an organic laminate substrate","assignee":null,"inventors":[],"filing_date":"2020-01-31T00:00:00.000Z","publication_date":"2022-02-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Mitigating thermal-mechanical strain and warpage of an organic laminate substrate","description":"A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11239183","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11239183","citation_suggestion":"Patentable. \"Mitigating thermal-mechanical strain and warpage of an organic laminate substrate\" (US-11239183). https://patentable.app/patents/US-11239183","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11239183","json":"https://patentable.app/api/llm-context/US-11239183","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:04:57.939Z"}