{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11239217","patent":{"patent_number":"US-11239217","title":"Semiconductor package including a first sub-package stacked atop a second sub-package","assignee":null,"inventors":[],"filing_date":"2020-03-30T00:00:00.000Z","publication_date":"2022-02-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A semiconductor package includes a first sub-package and a second sub-package. The first sub-package is stacked atop the second sub-package. Each of the first sub-package and the second sub-package includes at least two first semiconductor dies, a second semiconductor die, a plurality of molding pieces, a bond-pad layer, a plurality of redistribution layers (RDLs) and a plurality of bumps. The bumps of the first sub-package are attached to the bond-pad layer of the second sub-package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package including a first sub-package stacked atop a second sub-package","description":"A semiconductor package includes a first sub-package and a second sub-package. The first sub-package is stacked atop the second sub-package. Each of the first sub-package and the second sub-package in","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11239217","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11239217","citation_suggestion":"Patentable. \"Semiconductor package including a first sub-package stacked atop a second sub-package\" (US-11239217). https://patentable.app/patents/US-11239217","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11239217","json":"https://patentable.app/api/llm-context/US-11239217","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:06:09.746Z"}