{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11239219","patent":{"patent_number":"US-11239219","title":"Passive device module and semiconductor package including the same","assignee":null,"inventors":[],"filing_date":"2020-03-12T00:00:00.000Z","publication_date":"2022-02-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A semiconductor package including a lower redistribution layer including wiring patterns; a lower substrate on the lower redistribution layer, the lower substrate including a cavity; an application processor on the lower redistribution layer in the cavity; a cache memory chip on the application processor; a passive device module on the application processor; a plurality of first through-silicon vias penetrating the application processor to connect the lower redistribution layer to the passive device module; and lower bumps on a bottom surface of the lower redistribution layer, wherein the passive device module is adjacent to a side of the cache memory chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Passive device module and semiconductor package including the same","description":"A semiconductor package including a lower redistribution layer including wiring patterns; a lower substrate on the lower redistribution layer, the lower substrate including a cavity; an application pr","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11239219","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11239219","citation_suggestion":"Patentable. \"Passive device module and semiconductor package including the same\" (US-11239219). https://patentable.app/patents/US-11239219","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11239219","json":"https://patentable.app/api/llm-context/US-11239219","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T22:36:25.420Z"}