{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11239220","patent":{"patent_number":"US-11239220","title":"Semiconductor package and method of fabricating the same","assignee":null,"inventors":[],"filing_date":"2020-06-30T00:00:00.000Z","publication_date":"2022-02-01T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"The present disclosure provides a semiconductor package. The semiconductor package includes a carrier member, a plurality of inductors and a memory chip. The carrier member includes a first surface, a second surface and a centrally-located opening. The carrier member also includes a plurality of conductive pads on the second surface proximal to the opening. The memory chip is attached to the carrier member in a face-down manner. The memory chip includes a plurality of bidirectional and unidirectional signal-transmission pins electrically coupled to the inductors. The memory chip also includes a plurality of bonding pads. A plurality of bonding wires, passing through the opening, electrically connect the bonding pads on the memory chip to the conductive pads on the carrier member. A first insulative structure substantially encapsulates the memory chip and the inductors. A plurality of solder balls are attached to the second surface of the carrier member."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and method of fabricating the same","description":"The present disclosure provides a semiconductor package. The semiconductor package includes a carrier member, a plurality of inductors and a memory chip. The carrier member includes a first surface, a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11239220","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11239220","citation_suggestion":"Patentable. \"Semiconductor package and method of fabricating the same\" (US-11239220). https://patentable.app/patents/US-11239220","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11239220","json":"https://patentable.app/api/llm-context/US-11239220","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:37:07.614Z"}