{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11243573","patent":{"patent_number":"US-11243573","title":"Semiconductor package, display apparatus and manufacturing method of semiconductor package","assignee":null,"inventors":[],"filing_date":"2020-04-28T00:00:00.000Z","publication_date":"2022-02-08T00:00:00.000Z","cpc_codes":["G02F","G06F","G06F","G09G","G09G","G09G"],"num_claims":20,"abstract":"A semiconductor package includes a flexible substrate and a semiconductor device. The flexible substrate includes a device bonding region and a device top metallization structure including a plurality of device signal lines and a plurality of device power lines extended beyond the device bonding region. The semiconductor device is disposed on the device bonding region and includes an interconnecting metallization structure and a passivation layer covering the interconnecting metallization structure and revealing a plurality of interconnect contacts of the interconnecting metallization structure, wherein the plurality of interconnect contacts electrically connected to one another through the device top metallization structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package, display apparatus and manufacturing method of semiconductor package","description":"A semiconductor package includes a flexible substrate and a semiconductor device. The flexible substrate includes a device bonding region and a device top metallization structure including a plurality","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11243573","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11243573","citation_suggestion":"Patentable. \"Semiconductor package, display apparatus and manufacturing method of semiconductor package\" (US-11243573). https://patentable.app/patents/US-11243573","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11243573","json":"https://patentable.app/api/llm-context/US-11243573","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:37:19.509Z"}