{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11244863","patent":{"patent_number":"US-11244863","title":"Method for manufacturing semiconductor apparatus","assignee":null,"inventors":[],"filing_date":"2018-05-28T00:00:00.000Z","publication_date":"2022-02-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"A resin membrane (8) covering a semiconductor device (5) and a dicing line (7) of a semiconductor substrate (1) is formed on a main surface of the semiconductor substrate (1).The resin membrane (8) around the first electrode (2) is removed and the resin membrane (8) on the second electrode (3,4) is removed to form a first contact hole (9) without removing the resin membrane (8) on the dicing line (7). A resin film (11) is applied to a top surface of the resin membrane (8) to form a hollow structure (12) around the first electrode (2). The resin film (11) is patterned to form a second contact hole (13) connected to the first contact hole (9) and a first opening (14) above the dicing line (7) simultaneously. After forming the first opening (14), the semiconductor substrate (1) is diced along the dicing line (7)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for manufacturing semiconductor apparatus","description":"A resin membrane (8) covering a semiconductor device (5) and a dicing line (7) of a semiconductor substrate (1) is formed on a main surface of the semiconductor substrate (1).The resin membrane (8) ar","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11244863","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11244863","citation_suggestion":"Patentable. \"Method for manufacturing semiconductor apparatus\" (US-11244863). https://patentable.app/patents/US-11244863","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11244863","json":"https://patentable.app/api/llm-context/US-11244863","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T08:28:32.663Z"}