{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11244881","patent":{"patent_number":"US-11244881","title":"Package terminal cavities","assignee":null,"inventors":[],"filing_date":"2019-09-30T00:00:00.000Z","publication_date":"2022-02-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A package comprises a molding and a conductive terminal in contact with the molding and having a first surface exposed to a first surface of the molding. The conductive terminal includes a cavity having a first portion extending along at least half of the first surface of the conductive terminal and a second portion extending along less than half of the first surface of the conductive terminal."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package terminal cavities","description":"A package comprises a molding and a conductive terminal in contact with the molding and having a first surface exposed to a first surface of the molding. The conductive terminal includes a cavity havi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11244881","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11244881","citation_suggestion":"Patentable. \"Package terminal cavities\" (US-11244881). https://patentable.app/patents/US-11244881","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11244881","json":"https://patentable.app/api/llm-context/US-11244881","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:30:04.580Z"}