{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11244884","patent":{"patent_number":"US-11244884","title":"Semiconductor package with floating heat spreader and process for making the same","assignee":null,"inventors":[],"filing_date":"2020-07-10T00:00:00.000Z","publication_date":"2022-02-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"The present disclosure relates to a semiconductor package, which includes a carrier, a flip-chip die, a mold compound, and a heat spreader. Herein, the flip-chip die includes a device layer over the carrier and a die substrate over the device layer. The mold compound resides over the carrier and surrounds the flip-chip die. The mold compound has a recess adjacent to the flip-chip die, and the recess extends vertically lower than a top surface of the die substrate. The heat spreader hangs over the flip-chip die, and includes a spreader body that is thermally coupled to the die substrate, and a spreader protrusion that extends from the spreader body into the recess. A thickness of the spreader protrusion is shorter than a depth of the recess, and a width of the spreader protrusion is narrower than a width of the recess, such that the spreader protrusion is floating in the recess."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package with floating heat spreader and process for making the same","description":"The present disclosure relates to a semiconductor package, which includes a carrier, a flip-chip die, a mold compound, and a heat spreader. Herein, the flip-chip die includes a device layer over the c","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11244884","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11244884","citation_suggestion":"Patentable. \"Semiconductor package with floating heat spreader and process for making the same\" (US-11244884). https://patentable.app/patents/US-11244884","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11244884","json":"https://patentable.app/api/llm-context/US-11244884","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:53:12.099Z"}