{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11244891","patent":{"patent_number":"US-11244891","title":"Integrated circuit package and die","assignee":null,"inventors":[],"filing_date":"2020-07-21T00:00:00.000Z","publication_date":"2022-02-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"An integrated circuit package, a die carrier, and a die are provided. The die carrier includes at least one die pad and a plurality of leads. The at least one die pad is suitable for carrying the die. The leads surround the at least one die pad. The leads are disposed on four sides of the die carrier. A length of a long side among the four sides is twice or more a length of a short side among the four sides. The die carrier is suitable for a QFN package or a QFP package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit package and die","description":"An integrated circuit package, a die carrier, and a die are provided. The die carrier includes at least one die pad and a plurality of leads. The at least one die pad is suitable for carrying the die.","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11244891","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11244891","citation_suggestion":"Patentable. \"Integrated circuit package and die\" (US-11244891). https://patentable.app/patents/US-11244891","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11244891","json":"https://patentable.app/api/llm-context/US-11244891","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T20:12:06.078Z"}