{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11244897","patent":{"patent_number":"US-11244897","title":"Back end of line metallization","assignee":null,"inventors":[],"filing_date":"2020-04-06T00:00:00.000Z","publication_date":"2022-02-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"Interconnect structures and methods for forming the interconnect structures generally include a subtractive etching process to form a fully aligned top via and metal line interconnect structure. The interconnect structure includes a top via and a metal line formed of an alternative metal other than copper or tungsten. A conductive etch stop layer is intermediate the top via and the metal line. The top via is fully aligned to the metal line."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Back end of line metallization","description":"Interconnect structures and methods for forming the interconnect structures generally include a subtractive etching process to form a fully aligned top via and metal line interconnect structure. The i","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11244897","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11244897","citation_suggestion":"Patentable. \"Back end of line metallization\" (US-11244897). https://patentable.app/patents/US-11244897","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11244897","json":"https://patentable.app/api/llm-context/US-11244897","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T17:29:22.975Z"}