{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11244899","patent":{"patent_number":"US-11244899","title":"Butted contacts and methods of fabricating the same in semiconductor devices","assignee":null,"inventors":[],"filing_date":"2020-01-17T00:00:00.000Z","publication_date":"2022-02-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor structure includes a metal gate structure disposed over a semiconductor substrate, a gate spacer disposed on a sidewall of the metal gate structure, an source/drain contact disposed over the semiconductor substrate and separated from the metal gate structure by the gate spacer, and a contact feature coupling the metal gate structure to the source/drain contact. The contact feature may be configured to include a dielectric layer disposed on a metal layer, where the dielectric layer and the metal layer are defined by continuous sidewalls."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Butted contacts and methods of fabricating the same in semiconductor devices","description":"A semiconductor structure includes a metal gate structure disposed over a semiconductor substrate, a gate spacer disposed on a sidewall of the metal gate structure, an source/drain contact disposed ov","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11244899","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11244899","citation_suggestion":"Patentable. \"Butted contacts and methods of fabricating the same in semiconductor devices\" (US-11244899). https://patentable.app/patents/US-11244899","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11244899","json":"https://patentable.app/api/llm-context/US-11244899","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T14:46:22.725Z"}