{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11244914","patent":{"patent_number":"US-11244914","title":"Bond pad with enhanced reliability","assignee":null,"inventors":[],"filing_date":"2020-05-05T00:00:00.000Z","publication_date":"2022-02-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method may be performed by forming a bond pad layer onto a dielectric structure formed over a substrate. The dielectric structure surrounds a plurality of interconnect layers. A protective layer is formed onto the bond pad layer, and the bond pad layer and the protective layer are patterned to define a bond pad covered by the protective layer. One or more upper passivation layers are formed over the protective layer. A dry etching process is performed to form an opening extending through the one or more upper passivation layers to the protective layer. A wet etching process is performed to remove a part of the protective layer and expose an upper surface of the bond pad."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Bond pad with enhanced reliability","description":"The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method may be performed by forming a bond pad layer onto a dielectric structure formed over a substr","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11244914","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11244914","citation_suggestion":"Patentable. \"Bond pad with enhanced reliability\" (US-11244914). https://patentable.app/patents/US-11244914","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11244914","json":"https://patentable.app/api/llm-context/US-11244914","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T20:33:13.631Z"}