{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11244918","patent":{"patent_number":"US-11244918","title":"Molded semiconductor package and related methods","assignee":null,"inventors":[],"filing_date":"2017-08-17T00:00:00.000Z","publication_date":"2022-02-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"Implementations of semiconductor packages may include: a semiconductor die having a first side and a second side; one or more bumps included on the first side of the wafer, the bumps comprising a first layer having a first metal and a second layer including a second metal. The first layer may have a first thickness and the second layer may have a second thickness. The semiconductor package may also have a mold compound encapsulating all the semiconductor die except for a face of the one or more bumps."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Molded semiconductor package and related methods","description":"Implementations of semiconductor packages may include: a semiconductor die having a first side and a second side; one or more bumps included on the first side of the wafer, the bumps comprising a firs","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11244918","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11244918","citation_suggestion":"Patentable. \"Molded semiconductor package and related methods\" (US-11244918). https://patentable.app/patents/US-11244918","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11244918","json":"https://patentable.app/api/llm-context/US-11244918","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:14:19.472Z"}