{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11244939","patent":{"patent_number":"US-11244939","title":"Package structure and method of forming the same","assignee":null,"inventors":[],"filing_date":"2020-03-26T00:00:00.000Z","publication_date":"2022-02-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Embodiments of the disclosure provide a package structure and method of forming the same. The package structure includes a first die, a first encapsulant, a first RDL structure, a die stack structure and a second encapsulant. The first encapsulant laterally encapsulates the first die. The first RDL structure is electrically connected to the first die, and disposed on a first side of the first die and the first encapsulant. The die stack structure is electrically connected to the first die and disposed on a second side of the first die opposite to the first side. The second encapsulant is located over the first encapsulant and laterally encapsulating the die stack structure. A sidewall of the first encapsulant is aligned with a sidewall of the second encapsulant."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure and method of forming the same","description":"Embodiments of the disclosure provide a package structure and method of forming the same. The package structure includes a first die, a first encapsulant, a first RDL structure, a die stack structure ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11244939","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11244939","citation_suggestion":"Patentable. \"Package structure and method of forming the same\" (US-11244939). https://patentable.app/patents/US-11244939","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11244939","json":"https://patentable.app/api/llm-context/US-11244939","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T11:12:44.296Z"}