{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11245383","patent":{"patent_number":"US-11245383","title":"Packages with organic back ends for electronic components","assignee":null,"inventors":[],"filing_date":"2019-07-25T00:00:00.000Z","publication_date":"2022-02-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":43,"abstract":"A packaged electronic component comprising: an electronic component housed within a package comprising a front part of a package comprising an inner section with a front cavity therein opposite the electronic component defined by the raised frame and an outer section sealing said cavity; and a back part of the package comprising a back cavity in an inner back section, and an outer back section sealing the cavity, said back package further comprising a first and a second via through the back end around said at least one back cavity for coupling to front and back electrodes of the electronic component; the vias terminating in external contact pads adapted to couple the package in a flip chip configuration to a circuit board."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packages with organic back ends for electronic components","description":"A packaged electronic component comprising: an electronic component housed within a package comprising a front part of a package comprising an inner section with a front cavity therein opposite the el","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11245383","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11245383","citation_suggestion":"Patentable. \"Packages with organic back ends for electronic components\" (US-11245383). https://patentable.app/patents/US-11245383","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11245383","json":"https://patentable.app/api/llm-context/US-11245383","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T03:57:12.156Z"}