{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11246211","patent":{"patent_number":"US-11246211","title":"Micro device with through PCB cooling","assignee":null,"inventors":[],"filing_date":"2021-03-01T00:00:00.000Z","publication_date":"2022-02-08T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Micro devices having enhanced through printed circuit board (PCB) heat transfer are provided. In one example, a micro device is provided that includes a PCB, a thermal management device, a chip package, a bracket, and a plurality of extra-package heat conductors. The chip package has a first side facing the thermal management device and a second side mounted to a first side of the PCB. The bracket is disposed on a second side of the PCB that faces away from the chip package. The plurality of extra-package heat conductors are disposed laterally outward of the chip package and provide at least a portion of a thermally conductive heat transfer path between the bracket and the thermal management device through the PCB."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Micro device with through PCB cooling","description":"Micro devices having enhanced through printed circuit board (PCB) heat transfer are provided. In one example, a micro device is provided that includes a PCB, a thermal management device, a chip packag","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11246211","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11246211","citation_suggestion":"Patentable. \"Micro device with through PCB cooling\" (US-11246211). https://patentable.app/patents/US-11246211","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11246211","json":"https://patentable.app/api/llm-context/US-11246211","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T06:17:00.804Z"}