{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11250185","patent":{"patent_number":"US-11250185","title":"Method and apparatus for calculating equivalent mechanical parameters of film layer etching region","assignee":null,"inventors":[],"filing_date":"2018-09-25T00:00:00.000Z","publication_date":"2022-02-15T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F","H01L","G06F","G06F","H01L"],"num_claims":20,"abstract":"A method for calculating equivalent mechanical parameters of a film layer etching region is provided, by which more accurate equivalent mechanical parameters, which will be used in a process of manufacturing a display substrate of a terminal, may be obtained, thereby obtaining a display substrate with less defects. The method includes: selecting at least a part of the film layer etching region as an analysis region; establishing a planar model corresponding to the analysis region; performing grid division on the planar model at a first density; analyzing, by means of a finite element method, first simulation stresses of the planar model in simulated boundary conditions according to the actual mechanical parameters of a film layer material and the grid division of the first density; and calculating equivalent mechanical parameters."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method and apparatus for calculating equivalent mechanical parameters of film layer etching region","description":"A method for calculating equivalent mechanical parameters of a film layer etching region is provided, by which more accurate equivalent mechanical parameters, which will be used in a process of manufa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11250185","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11250185","citation_suggestion":"Patentable. \"Method and apparatus for calculating equivalent mechanical parameters of film layer etching region\" (US-11250185). https://patentable.app/patents/US-11250185","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11250185","json":"https://patentable.app/api/llm-context/US-11250185","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T12:00:54.533Z"}