{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11250560","patent":{"patent_number":"US-11250560","title":"Methods and systems for expediting multi-perspective wafer analysis","assignee":null,"inventors":[],"filing_date":"2020-07-08T00:00:00.000Z","publication_date":"2022-02-15T00:00:00.000Z","cpc_codes":["G06T","G06T","G06T","G06T","G06T","G06T","G06T"],"num_claims":15,"abstract":"Disclosed herein is method for multi-perspective-based wafer analysis. The method includes (i) scanning a plurality of pages, or portions thereof, one after the other, wherein each page, or a portion thereof, is successively scanned, in each of a multiplicity of perspectives, and (ii) analyzing scan data of a last scanned page while scanning a next page from the plurality of pages. At least some of the pages include multiple slices of the wafer. The analysis of the scan data includes identifying defects in the scanned pages, based on an integrated analysis combining scan data from each of the multiplicity of perspectives. Further disclosed is a computerized system configured to implement the method."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods and systems for expediting multi-perspective wafer analysis","description":"Disclosed herein is method for multi-perspective-based wafer analysis. The method includes (i) scanning a plurality of pages, or portions thereof, one after the other, wherein each page, or a portion ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11250560","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11250560","citation_suggestion":"Patentable. \"Methods and systems for expediting multi-perspective wafer analysis\" (US-11250560). https://patentable.app/patents/US-11250560","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11250560","json":"https://patentable.app/api/llm-context/US-11250560","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T08:36:19.023Z"}