{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11251074","patent":{"patent_number":"US-11251074","title":"Integrated circuit structure and method for preparing the same","assignee":null,"inventors":[],"filing_date":"2020-07-16T00:00:00.000Z","publication_date":"2022-02-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"The present disclosure provides an integrated circuit structure with dielectric isolation structure for reducing capacitive coupling and crosstalk between conductive features and a method for preparing the same. The method includes: forming a first conductive structure over a substrate; forming a first dielectric structure over the first conductive structure; transforming a sidewall portion of the first conductive structure into a first dielectric portion; removing the first dielectric portion such that a width of the first dielectric structure is greater than a width of a remaining portion of the first conductive structure; forming an inter-layer dielectric (ILD) layer covering a sidewall of the first dielectric structure; forming a reinforcement pillar of energy removable material in the ILD layer; forming a capping dielectric layer over the reinforcement pillar; and performing a thermal process to transform the reinforcement pillar into a dielectric isolation structure including a liner layer enclosing an air gap."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit structure and method for preparing the same","description":"The present disclosure provides an integrated circuit structure with dielectric isolation structure for reducing capacitive coupling and crosstalk between conductive features and a method for preparin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11251074","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11251074","citation_suggestion":"Patentable. \"Integrated circuit structure and method for preparing the same\" (US-11251074). https://patentable.app/patents/US-11251074","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11251074","json":"https://patentable.app/api/llm-context/US-11251074","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T01:59:19.760Z"}