{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11251644","patent":{"patent_number":"US-11251644","title":"Packaged semiconductor devices with wireless charging means","assignee":null,"inventors":[],"filing_date":"2020-05-06T00:00:00.000Z","publication_date":"2022-02-15T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H02J","H02J","H04B","H04B","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device package is provided, including a semiconductor device, a molding material, and a conductive slot. The molding material surrounds the semiconductor device. The conductive slot is positioned over the molding material and having an opening and at least two channels connecting the opening to the edges of the conductive slot."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Packaged semiconductor devices with wireless charging means","description":"A semiconductor device package is provided, including a semiconductor device, a molding material, and a conductive slot. The molding material surrounds the semiconductor device. The conductive slot is","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11251644","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11251644","citation_suggestion":"Patentable. \"Packaged semiconductor devices with wireless charging means\" (US-11251644). https://patentable.app/patents/US-11251644","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11251644","json":"https://patentable.app/api/llm-context/US-11251644","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T16:57:27.638Z"}