{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11254563","patent":{"patent_number":"US-11254563","title":"Mold material architecture for package device structures","assignee":null,"inventors":[],"filing_date":"2018-04-25T00:00:00.000Z","publication_date":"2022-02-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"Embodiments include a microelectronic device package structure having a die on a substrate, where a first side of the die is electrically coupled to the substrate, and a second side of the die is covered with a first material having a first thermal conductivity. A second material is adjacent to a sidewall of the die and adjacent to a sidewall of the first material. The second material has second thermal conductivity, smaller than the first thermal conductivity. The second material may have mechanical and/or underfill properties superior to those of the first material. Together, the two materials may provide a package structure having enhanced thermal and mechanical performance."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Mold material architecture for package device structures","description":"Embodiments include a microelectronic device package structure having a die on a substrate, where a first side of the die is electrically coupled to the substrate, and a second side of the die is cove","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11254563","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11254563","citation_suggestion":"Patentable. \"Mold material architecture for package device structures\" (US-11254563). https://patentable.app/patents/US-11254563","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11254563","json":"https://patentable.app/api/llm-context/US-11254563","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:10:44.374Z"}