{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11254567","patent":{"patent_number":"US-11254567","title":"Method for encapsulating a microelectronic device, comprising a step of thinning the substrate and/or the encapsulation cover","assignee":null,"inventors":[],"filing_date":"2019-01-24T00:00:00.000Z","publication_date":"2022-02-22T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":17,"abstract":"A method for encapsulating a microelectronic device, arranged on a support substrate, with an encapsulation cover includes, inter alia, the following sequence of steps: a) providing a support substrate on which a microelectronic device is arranged, b) depositing a bonding layer on the first face of the substrate, around the microelectronic device, c) positioning an encapsulation cover on the bonding layer in such a way as to encapsulate the microelectronic device, d) thinning the second main face of the support substrate and the second main face of the encapsulation cover by chemical etching."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for encapsulating a microelectronic device, comprising a step of thinning the substrate and/or the encapsulation cover","description":"A method for encapsulating a microelectronic device, arranged on a support substrate, with an encapsulation cover includes, inter alia, the following sequence of steps: a) providing a support substrat","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11254567","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11254567","citation_suggestion":"Patentable. \"Method for encapsulating a microelectronic device, comprising a step of thinning the substrate and/or the encapsulation cover\" (US-11254567). https://patentable.app/patents/US-11254567","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11254567","json":"https://patentable.app/api/llm-context/US-11254567","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T18:52:52.834Z"}