{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11257694","patent":{"patent_number":"US-11257694","title":"Semiconductor device having hybrid bonding interface, method of manufacturing the semiconductor device, and method of manufacturing semiconductor device assembly","assignee":null,"inventors":[],"filing_date":"2020-02-04T00:00:00.000Z","publication_date":"2022-02-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"The present disclosure provides a semiconductor device, a method of manufacturing the semiconductor device and a mothed of method of manufacturing a semiconductor device assembly. The semiconductor device includes a substrate, a bonding dielectric disposed on the substrate, a first conductive feature disposed in the bonding dielectric, an air gap disposed in the bonding dielectric to separate a portion of a periphery of the first conductive feature from the bonding dielectric, and a second conductive feature including a base disposed in the bonding dielectric and a protrusion stacked on the base."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device having hybrid bonding interface, method of manufacturing the semiconductor device, and method of manufacturing semiconductor device assembly","description":"The present disclosure provides a semiconductor device, a method of manufacturing the semiconductor device and a mothed of method of manufacturing a semiconductor device assembly. The semiconductor de","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11257694","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11257694","citation_suggestion":"Patentable. \"Semiconductor device having hybrid bonding interface, method of manufacturing the semiconductor device, and method of manufacturing semiconductor device assembly\" (US-11257694). https://patentable.app/patents/US-11257694","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11257694","json":"https://patentable.app/api/llm-context/US-11257694","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T07:34:44.321Z"}