{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11257735","patent":{"patent_number":"US-11257735","title":"Heat sink-equipped power module substrate and manufacturing method for heat sink-equipped power module substrate","assignee":null,"inventors":[],"filing_date":"2018-11-05T00:00:00.000Z","publication_date":"2022-02-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":4,"abstract":"The invention provides a power module substrate with a heat sink, which includes a power module substrate provided with an insulating substrate, a circuit layer provided on one surface of the insulating substrate and a metal layer provided on the other surface of the insulating substrate. The heat sink is bonded to the power module substrate via a bonding layer (30) to a surface on an opposite side to the insulating substrate of the metal layer. Bonding layer is a sintered body of silver particles, a porous body having a relative density in a range of 60% or more and 90% or less, and having a thickness in a range of 10 μm or more and 500 μm or less."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat sink-equipped power module substrate and manufacturing method for heat sink-equipped power module substrate","description":"The invention provides a power module substrate with a heat sink, which includes a power module substrate provided with an insulating substrate, a circuit layer provided on one surface of the insulati","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11257735","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11257735","citation_suggestion":"Patentable. \"Heat sink-equipped power module substrate and manufacturing method for heat sink-equipped power module substrate\" (US-11257735). https://patentable.app/patents/US-11257735","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11257735","json":"https://patentable.app/api/llm-context/US-11257735","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-31T00:40:10.593Z"}