{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11257747","patent":{"patent_number":"US-11257747","title":"Semiconductor package with conductive via in encapsulation connecting to conductive element","assignee":null,"inventors":[],"filing_date":"2019-04-12T00:00:00.000Z","publication_date":"2022-02-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"A semiconductor package including a semiconductor chip, a conductive element disposed aside the semiconductor chip, a conductive via disposed on and electrically connected to the conductive element, an insulating encapsulation, and a first circuit structure disposed on the semiconductor chip and the conductive via is provided. A height of the conductive element is less than a height of the semiconductor chip. The insulating encapsulation encapsulates the semiconductor chip, the conductive element, and the conductive via. The conductive via is located between the first circuit structure and the conductive element, and the semiconductor chip is electrically coupled to the conductive via through the first circuit structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package with conductive via in encapsulation connecting to conductive element","description":"A semiconductor package including a semiconductor chip, a conductive element disposed aside the semiconductor chip, a conductive via disposed on and electrically connected to the conductive element, a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11257747","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11257747","citation_suggestion":"Patentable. \"Semiconductor package with conductive via in encapsulation connecting to conductive element\" (US-11257747). https://patentable.app/patents/US-11257747","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11257747","json":"https://patentable.app/api/llm-context/US-11257747","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T14:12:24.242Z"}