{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11257748","patent":{"patent_number":"US-11257748","title":"Semiconductor package having polymeric interlayer disposed between conductive elements and dielectric layer","assignee":null,"inventors":[],"filing_date":"2017-06-30T00:00:00.000Z","publication_date":"2022-02-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"The present disclosure provides a substrate for an integrated circuit. The substrate includes a dielectric layer. The substrate further includes a plurality of conductive elements at least partially embedded within the dielectric layer and having a substantially smooth outer surface. The substrate further includes an interlayer disposed between the individual conductive elements and the dielectric layer. The interlayer has a first surface comprising a plurality of protrusions interlocked with the dielectric layer and a second surface adhered to the outer surface of the individual conductive elements."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package having polymeric interlayer disposed between conductive elements and dielectric layer","description":"The present disclosure provides a substrate for an integrated circuit. The substrate includes a dielectric layer. The substrate further includes a plurality of conductive elements at least partially e","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11257748","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11257748","citation_suggestion":"Patentable. \"Semiconductor package having polymeric interlayer disposed between conductive elements and dielectric layer\" (US-11257748). https://patentable.app/patents/US-11257748","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11257748","json":"https://patentable.app/api/llm-context/US-11257748","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T21:01:14.137Z"}