{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11257749","patent":{"patent_number":"US-11257749","title":"Wiring substrate","assignee":null,"inventors":[],"filing_date":"2019-11-22T00:00:00.000Z","publication_date":"2022-02-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"A wiring substrate includes: a core layer having a first face, and a second face opposite to the first face; a through hole that penetrates the core layer; a first metal layer formed on an inner wall face of the through hole and formed on or above the first and second faces; a second metal layer that is formed on the first metal layer and fills the through hole, wherein the second metal layer has a first recess portion opposed to the through hole, and a second recess portion opposed to the first recess portion via the through hole; a third metal layer provided in the first recess portion; a fourth metal layer provided in the second recess portion; a fifth metal layer formed on the second metal layer and the third metal layer; and a sixth metal layer formed on the second metal layer and the fourth metal layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate","description":"A wiring substrate includes: a core layer having a first face, and a second face opposite to the first face; a through hole that penetrates the core layer; a first metal layer formed on an inner wall ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11257749","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11257749","citation_suggestion":"Patentable. \"Wiring substrate\" (US-11257749). https://patentable.app/patents/US-11257749","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11257749","json":"https://patentable.app/api/llm-context/US-11257749","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T15:56:25.923Z"}