{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-11257751","patent":{"patent_number":"US-11257751","title":"Semiconductor device with step-like wiring layers and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2019-08-30T00:00:00.000Z","publication_date":"2022-02-22T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"A device includes: a substrate; a first wiring layer above the substrate; a second wiring layer above the first wiring layer; a first insulating film on the first and second wiring layers; a second insulating film in the first insulating film, provided at a position overlapping with a part of the first wiring layer and a part of the second wiring layer in a first direction perpendicular to a surface of the substrate, and including a first portion higher than an upper surface of an end portion of the second wiring layer and a second portion lower than the upper surface of the end portion of the second wiring layer; and a plug via the second insulating film in the first insulating film, provided on the upper surface of the end portion of the second wiring layer, and electrically connected to the second wiring layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device with step-like wiring layers and manufacturing method thereof","description":"A device includes: a substrate; a first wiring layer above the substrate; a second wiring layer above the first wiring layer; a first insulating film on the first and second wiring layers; a second in","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-11257751","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-11257751","citation_suggestion":"Patentable. \"Semiconductor device with step-like wiring layers and manufacturing method thereof\" (US-11257751). https://patentable.app/patents/US-11257751","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-11257751","json":"https://patentable.app/api/llm-context/US-11257751","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-05-30T09:40:00.534Z"}